Cu50Cr50触头材料的性能

Properties of Cu50Cr50 Contact Material

采用松装熔渗方法制备Ｃｕ５０Ｃｒ５０真空断路器用触头材料。研究了电解Ｃｒ粉粒度、粉末的含氧量及添加Ｎｉ粉末对Ｃｕ５０Ｃｒ５０触头材料性能的影响。结果表明，使用粒度为７５μｍ～１５０μｍ的预处理电解铬粉末和无氧铜块，在干燥的氢气气氛中，于１２００℃进行３０ｍｉｎ熔渗，可获得含氧量为００３％、含氮量（００３～０００６）％、［质量］密度（７８～７９）ｇ／ｃｍ３、电导率（１５０～１７６）×１０７／Ω·ｍ的Ｃｕ５０Ｃｒ５０触头材料。添加Ｎｉ有利于提高触头材料的［质量］密度，但其电导率却有所降低。采用真空熔渗方法，可使Ｃｕ５０Ｃｒ５０触头材料的含氮量降至０００３％。

A contact material for medium voltage vacuum power switches has been produced by loose-packing and impregnating. The effects of electrolytic Cr powder size, oxygen and nitrogen contents, and the third element Ni content on the properties of contact material have been studied. Impregnating an electrolytic Cr powder(76μm～150μm) compact with OFHC-Cu for 30 minutes at 1200℃ in dry hydrogen, a good Cu50Cr50 contact material with 003% oxygen and (0003～0006)% nitrogen, a density of (78～79)g/cm3 and good conductivity ((150～176)×107/Ω·m) can be obtained The inclusion of a third element, Ni, increases the density of contact material, but diminishes the conductivity; The optimal Ni content is 02%～06% The nitrogen content of the contact material can be decreased to 0003% by impregnating in vacuum