摘要
Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on the properties (especially bonding) of copper coating has been studied using electrochemical methods. The results show that the optimal additives of pyrophosphate copper electroplating are C4H4O6KNa(25g/L)+ H2C2O4(25g/L)and C4H4O6KNa(25g/L),respectively.
Copper pyrophosphate plating is the most important electroplating process which can instead of copper cyanide electroplating, but the biggest shortcoming is poor adhesion. In this paper, the influence of additives on the properties （especially bonding） of copper coating has been studied using electrochemical methods. The results show that the optimal additives of pyrophosphate copper electroplating are C4H4O6KNa（25g/L） ＋ H2C2O4（25g/L） and C4H4O6KNa（25g/L） ,respectively.
出处
《化学研究与应用》
CAS
CSCD
北大核心
2008年第3期307-311,共5页
Chemical Research and Application
关键词
焦磷酸盐镀铜
添加剂
镀层性能
copper pyrophosphate plating
additives
coating properties
