反应磁控溅射沉积工艺对Cr-N涂层微观结构的影响

Effect of depositing process on microstructure chromium nitride coatings deposited by reactive magnetron sputtering

研究在不同工艺条件下用直流反应磁控溅射技术在T10衬底上制备Cr-N涂层,并采用光电子能谱仪和XRD依次分析Cr-N涂层的表面结构和工艺参数对Cr-N涂层成分及相组成的影响。结果表明,Cr-N涂层在存放一段时间后表面产生复杂的Cr2O3相以及Cr(O,N)x相;常温下随着N2含量的增加,涂层相结构逐渐由Cr转变为化学比的CrN相。当N2含量为33.3%时,Cr-N涂层的相成分主要为Cr2N+CrN。并发现衬底偏压直接影响Cr-N系涂层的晶态及取向特征,当偏压增加到-130 V时,Cr-N涂层中β-Cr2N相结构逐渐转变为(110)和(300)取向结构。

A series of chromium-nitride coatings deposited on T10 substrates were prepared by direct current reactive magnetron sputtering with variable processing conditions, the phase and composition variation with different depositing processes were analyzed by X-ray diffraction, and surface structure of Cr-N coatings was analyzed by X-ray photoelectron spectroscopy. The results indicate that complicated Cr2O3 and Cr（O, N）x occur on surface of Cr-N coatings after these samples are deposited, under normal temperature conditions the phase changes from Cr to stoichiometry CrN with reactive gas N2 increasing. Phase composition of chromium-nitride coatings is mainly β-Cr2N＋CrN when N2 content is 33.3 %. Substrate bias voltage has significant effect on the phase state and the lattice orientation of the coating. As the bias voltage increases to -130 V, the diffraction summit of β-Cr2N phase gradually transfers into preferential orientations of（110） and （300）.