“电位活化”现象与无氰直接镀铜

Potential activation phenomenon and non-cyanide direct copper plating

"电位活化"现象认为,当金属离子在阴极还原的初始电位负于金属基体表面的活化电位时,电沉积的初始过程将首先完成对金属基体的活化,随后镀层沉积在活化的基体表面,形成具有牢固结合强度的电镀层。简要阐述了电位活化的研究概况和基本观点。应用电位活化概念对工艺进行改进,以提高焦磷酸盐镀铜、HEDP镀铜、乙二胺镀铜等无氰镀铜层在钢铁基体上的结合强度。

The potential activation theory indicates that when the initial potential of cathodic reduction of ions is more negative than the activation potential of metal substrate surface, the activation of metal substrate will first be completed finish at first in the initial process of electro-deposition, and then metal deposits on the activated substrate surface, and thereby the electroplated layer with good adhesion is formed. The study survey and basic points of view were introduced. The process was improved by applying the potential activation theory so as to increase the adhesion strength of non-cyanide copper deposits obtained from pyrophosphate copper plating, HEDP copper plating, ethylenediamine copper plating baths and so on.