摘要
介绍了一种新的无氰碱铜工艺。采用多种配体,加入一定的添加剂,通过协同效应,使镀层的结合力和镀液的稳定性得以很大提高。该镀液长时间使用后能保持电流密度范围稳定。该工艺能在铁、黄铜、锌和锌合金、铝浸锌等基材上直接电镀,镀层光亮,结合力接近于氰化物镀铜。
A new non-cyanide alkaline copper plating process was introduced. The adhesion of deposit and the stability of bath were greatly improved by the addition of various kinds of ligand and additive through synergetic effect. The range of current density is still stable after the bath is used for a long time. The deposit can be directly deposited on the surface of iron, brass, zinc and its alloy and zincated aluminum, and the deposit obtained by the process is bright and has similar adhesion to that of cyanide copper plating deposit.
出处
《电镀与涂饰》
CAS
CSCD
2008年第3期7-8,共2页
Electroplating & Finishing
关键词
碱性镀铜
无氰
协同效应
alkaline copper plating
non-cyanide
synergy effect
