高精电解铜箔环保型表面处理工艺研究

Study on environmental protection type surface treatment technology of electrolytic copper foil

采用锡酸钠、氯化锌、氯化镍做主盐，对印制电路用高精电解铜箔表面进行分形电沉积铜，再在碱性条件下电镀锌-锡-镍三元合金。避免了传统工艺中电解铜箔表面后处理使用砷的氧化物对环境的危害。结果表明：经本工艺处理的电解铜箔的合金镀层中锌含量为52％～70％、锡含量为10％～34％、镍含量为10％～28％，达到了传统表面处理工艺下镀层对耐腐蚀性、耐热性等指标的要求。该锌-锡-镍合金电镀溶液稳定，成本低，污染小，操作简单，工艺范围宽，对设备的腐蚀性小。目前，该工艺已进行了连续的工业化试验，具有良好的应用前景。

Using sodium stannate, zinc chloride and nickel chloride as main salts, copper was fractally electrodeposited on the surface of top grade electrolytic copper foil used for printed circuitry, then the Zn-Sn-Ni alloy was electrode-posited under alkaline condition. The environmental harm caused by using arsenic oxides in traditional surface post-reatment of electrolytic copper foil was avoided. The results show that in the alloy deposit of electrolytic copper foil obtained by this process, the content of zinc is 52%-70%, tin 10%-34% and nickel 10%-28%. The deposit reaches the demand of corrosion and heat resistance obtained using traditional surface treatment technology. The Zn-Sn-Ni alloy plating solution has stability, low cost, little pollution, simple operation, wide technological range, and little corrosion to equipments. The above technology has been subjected to continued industrial experiments and has good application orosoect.