摘要
由于TOBUSHI本构模型难以分析形状和加载条件复杂的形状记忆聚合物(Shape Memory Polymer,SMP)构件及增强SMP材料的形状记忆行为,针对其形状记忆行为,利用有限元软件MSC Marc,基于黏弹性理论对SMP材料的热致形状记忆行为进行有限元数值模拟,得到的应力、应变和温度之间的关系与TOBUSHI的实验结果基本吻合,从而发展适用于复杂SMP构件及增强SMP材料形状记忆行为的有限元分析方法.
The TOBUSHI constitutive model is difficult to analyze the shape memory effect on Shape Memory Polymer （SMP） components with complex shapes or loads, and enhanced SMP. So based on viscoelastic theory, the finite element software MSC Marc is used to simulate thermally induced shape memory effect on SMP. The relationship among stress, strain and temperature is obtained, which coincides with TOBUSHI＇s experimental results. The proposed finite element method is applicable to analyze complex SMP components and SMP composites.
出处
《计算机辅助工程》
2008年第1期30-32,35,共4页
Computer Aided Engineering
