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胶粘剂在粘接接头内热分解动力学的计算

Measurement of heat decomposition dynamics of the adhesive in adhesive/c-c composites joints
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摘要 为了研究粘接接头内胶粘剂的耐热性能,采用X射线能谱分析确定了不同条件下粘接接头内胶粘剂的元素组成及其变化行为,利用X射线能谱计算了胶粘剂的热失重率,进而计算出聚酰亚胺薄膜粘接接头内胶粘剂的热分解动力学,并与空气环境下胶粘剂热分解活化能进行了比较.计算结果表明,粘接接头内胶粘剂的热分解速率低于空气环境下胶粘剂热分解速率,这种分析测试方法为原位表征粘接接头内胶粘剂耐热性能提供了一种新的分析方法. EDX analysis method was employed to measure the elements contents and changes of the adhesive in adhesive-PI joints,and the weight loss of the adhesive in adhesive-PI joints was measured by EDX,the heat decomposition dynamics of the adhesive in the joints was then calculated.Compared with the values of heat decomposition energy of the adhesive in different conditions,it is indicated that the heat decomposition energy of the adhesive in the joints is lower than that of the adhesive in air atmosphere.This analysis method is a new method in measuring some properties of adhesive in the joints.
出处 《材料科学与工艺》 EI CAS CSCD 北大核心 2008年第1期79-81,共3页 Materials Science and Technology
关键词 计算 粘接接头 热分解动力学 measurement adhesive joints heat decomposition dynamics
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