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电子组装用高温无铅钎料的研制 被引量：5

Development of high-temperature Pb-free solder for power die attachment
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摘要 Bi-Ag合金是一种替代高铅钎料的芯片封装无铅焊料。研制了Bi-2.5Ag、Bi-2.5Ag-0.1RE、Bi-5Ag-0.1RE、Bi-7.5Ag-0.1RE、Bi-10Ag、Bi-10Ag-0.1RE钎料。结果表明,该合金系钎料的熔化温度范围随Ag含量的增加而增大,而且其润湿性能良好,润湿角都处于30o～40o。不同Ag含量的Bi-Ag/Cu接头在界面处发生断裂,剪切强度差别不大,都略大于30MPa。Bi-Ag/Cu界面没有金属间化合物形成,结合强度较弱。 Bismuth-silver alloy can replace high Pb solders as a viable Pb-free power die-attach solder. Bi-Ag system lead-free solders including Bi-2.5Ag, Bi-2.5Ag-0.1RE, Bi-5Ag-0.1RE, Bi-7.5Ag-0.1RE, Bi-10Ag, Bi-10Ag-0.1RE were developed. The results indicate that the fused temperature of the Bi-Ag solders show a strongly increase with increase of Ag content. The Bi-Ag solders have good wettability and the range of wetting angle varies from 30^. to 40^.. The shear strengthes of the Bi-Ag solder joints with various Ag contents are almost the same and fracture occurs at the interface. There are no intermetallics generated at Bi-Ag/Cu interface, that lead to weak bonding intensity.
作者 房卫萍 史耀武 夏志东 郭福 雷永平
机构地区 北京工业大学材料科学与工程学院
出处 《电子元件与材料》 CAS CSCD 北大核心 2008年第3期15-18,共4页 Electronic Components And Materials
基金 "十一五"国家科技支撑重点资助项目(No.2006BAE03B02) 北京市属市管高等学校人才强教计划资助项目
关键词 金属材料 无铅钎料 Bi-Ag合金 metallic material lead-free solder Bi-Ag alloy
分类号 TN604 [电子电信—电路与系统]
  • 相关文献

参考文献8

  • 1McCluskey F P, Dash M, Wang Z, et al. Reliability of high temperature solder alternatives [J]. Microelectron Reliab, 2006, 46:1910-- 1914.
  • 2Kim J H, Jeong S W, Lee H M. Thermodynamics-aided alloy design and evaluation of Pb-free solders for high-temperature applications [J]. Mater Trans, 2002, 43(8): 1873--1878.
  • 3Shimizu T, Ishikawa H, Ohnuma I, et al. Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use [J]. J Electron Mater, 1999, 28(11): 1172-- 1175.
  • 4Lalena L N, Dean N F, Weiser M W. Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment [J]. J Electron Mater, 2002, 31(11): 1244--1249.
  • 5Rettenmayr M, Lambracht P, Kempf B, et al. High melting Pb-free solder alloys for die-attach applications [J]. Adv Eng Mater, 2005, 7(10): 965-- 969.
  • 6Song J M, Chuang H Y, Wu Z M. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates[J]. J Electron Mater, 2006, 35(5): 1041--1049.
  • 7Song J M, Chuang H Y, Wen T X. Thermal and tensile properties of Bi-Ag alloys [J]. Met Mater Trans, A 2007, 38A(6): 1371 -- 1375.
  • 8史耀武,夏志东,雷永平,李晓延,郭福.电子组装生产的无铅技术与发展趋势[J].电子工艺技术,2005,26(1):6-9. 被引量：27

二级参考文献3

  • 1Richard B. Lead - free soldering - world's apart, National Physical Laboratory[ EB]. NPL News, UK, http://www.lead - free. org, 2004.
  • 2Chen ZG, Shi YW, Xia ZD et al. Properties of leadfree solder SnAgCu containing minute amount of rare earth [J]. Journal of Electronic Materials, 2003, 32 (4) :235 - 243.
  • 3Nimmo K European and international roadmaps for leadfree technology [ EB ]. Soldertee at Tin Technology,UK, http://www. lead - free. org, 2004.

共引文献26

同被引文献83

引证文献5

二级引证文献18

电子元件与材料
2008年 第3期

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