新型电子封装用金刚石/金属复合材料的组织性能与应用

Properties and Application of Diamond/Metal Composites for Electronic Packaging

随着微电子技术的高速发展,金刚石/金属复合材料作为新一代的电子封装材料受到了广泛的重视,它与传统的电子封装材料相比,具有更优异的性能,是未来封装、热沉材料最有潜力的发展方向之一。对金刚石/金属复合材料的性能、制备工艺及应用发展进行了综述,并提出了未来的研究开发方向。

With the rapid development of microelectronic technology, diamond/metal composites as a new generation electronic packaging material have received more and more attention. Diamond/metal composites have more outstanding performance than the traditional electronic packaging materials. They have the most development potential to be the new gen- eration electronic packaging, heat sink materials. This paper overviews the properties, manufacturing process and applications of diamond/metal composites, and points out the problems to be resolved in the future.