铜/铝复合材料的固-液复合法制备及其界面结合机理

Fabrication of Cu/Al compound materials by solid-liquid bonding method and interface bonding mechanism

采用固-液复合法制备了铜/铝双金属复合材料,并对铜/铝复合界面的组织结构和结合性能进行了研究。在分析工艺参数对铜/铝复合界面影响规律的基础上,对复合工艺进行了优化。结果表明,在使用混合熔剂对铜板进行预处理的情况下,当铜板预热温度为400℃、铝液浇注温度为700℃时,可以获得铜/铝界面过渡层厚度为45μm、界面剪切强度达57MPa的良好复合界面。进一步研究表明,铜/铝复合界面的结合是通过铜/铝接触面上铜的熔化和向铝中的扩散实现的。

Cu/Al compound materials were fabricated by solid-liquid bonding method, and then the microstructures and bonding properties of Cu/Al interfaces were studied. According to the analysis of the effects of the processing parameters on Cu/Al interfaces, the bonding process was optimized. The results show that the well-bonded interface with a transition layer of about 45μm in thickness and a shear strength of 57 MPa can be obtained as the Cu plate pre-treated in a mix solution is preheated at 400 ℃ and the pouring temperature is 700℃. From further study, it is indicated that the bonding of the Cu/Al interface is carried out by the melting of copper and its diffusion in aluminum.