期刊文献+

Thermodynamic equilibrium calculation on preparation of copper oxalate precursor powder 被引量:3

Thermodynamic equilibrium calculation on preparation of copper oxalate precursor powder
下载PDF
导出
摘要 According to the principles of simultaneous equilibrium and mass balance,a series of thermodynamic equilibrium equations of Cu2+-C2O42--NH3-NH4+-H2O system at ambient temperature were deduced theoretically and the logarithm concentration versus pH value(lg[Cu 2+ ]T—pH)diagrams at different solution compositions were drawn.The results show that when pH is below 5.0,copper ion reacts with C2O42-directly and the morphology of copper precursor powder is of pie-shape;when pH is above 5.0,copper ion coordinates with ammonia,and the precipitation proceeds slowly accompanying with the release of copper ions from the multi-coordinated2+ 3Cu(NH) n (n=1,2,···,5)and the morphologies of copper precursor powder are respectively of rod aggregation shape(when 5.0<pH<8.0)and of rod-shape(when pH>8.0).Some experiments were performed to confirm the relation between the total concentration of copper ion and pH value.It is shown that the thermodynamic mathematical model is correct and the calculated values are basically accurate. According to the principles of simultaneous equilibrium and mass balance, a series of thermodynamic equilibrium equations of Cu^2+-C2O4^2--NH3-NH4^++-H2O system at ambient temperature were deduced theoretically and the logarithm concentration versus pH value (lg[Cu^2+]T--pH) diagrams at different solution compositions were drawn. The results show that when pH is below 5.0, copper ion reacts with C2O4^2- directly and the morphology of copper precursor powder is of pie-shape, when pH is above 5.0, copper ion coordinates with ammonia, and the precipitation proceeds slowly accompanying with the release of copper ions fi'om the multi-coordinated Cu(NH3)n^2+(n =1, 2,…, 5) and the morphologies of copper precursor powder are respectively of rod aggregation shape (when 5.0〈pH〈8.0) and of rod-shape (when pH〉8.0). Some experiments were performed to confirm the relation between the total concentration of copper ion and pH value. It is shown that the thermodynamic mathematical model is correct and the calculated values are basically accurate.
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2008年第2期454-458,共5页 Transactions of Nonferrous Metals Society of China
关键词 热力平衡 计算方法 草酸铜 冶金技术 thermodynamic equilibrium copper oxalate precursor ultrafme copper powder morphology
  • 相关文献

参考文献6

二级参考文献52

共引文献150

同被引文献24

  • 1王彦妮,张志琨,崔作林.纳米粒子在乙炔聚合反应中的催化作用[J].Chinese Journal of Catalysis,1995,16(4):304-307. 被引量:44
  • 2湛菁,张传福,李铁晶,邬建辉.Thermodynamic analysis on preparation of fibrous NiO precursor powders with oxalate precipitation process[J].中国有色金属学会会刊:英文版,2005,15(4):926-930. 被引量:5
  • 3MOUSTAFA S F, ABDEL-HAMID Z, ABD-ELHAY A M. Copper matrix SiC and Al2O3 particulate composites by powder metallurgy technique [J]. Materials Letters, 2002, 53(4/5): 244-249.
  • 4YASAR I, CANAKCI A, ARSLAN F. The effect of brush spring pressure on the wear behaviour of copper-graphite brushes with electrical current [J]. Tribology International, 2007, 40(9): 1381-1386.
  • 5MOHANTY S, CHUGH Y P. Development of fly ash-based automotive brake lining [J]. Tribology International, 2007, 40(7): 1217-1224.
  • 6ROSTOVSHCHIKOVA T N, SMIRNOV V V, KOZHEVIN V M, YAVSIN D A, ZABELIN M A, YASSIEVICHIN, GUREVICH S A. New size effect in the catalysis by interacting copper nanoparticles [J]. Applied Catalysis A: General, 2005, 296(1 ): 70-79.
  • 7BLATCHLEY E R, MARGETAS D, DUGGIRALA IZ. Copper catalysis in chloroform formation during water chlorination [J]. Water Research, 2003, 37(18): 4385-4394.
  • 8KE Wei, SHI Ze-min, QIAN Feng. Progress of preparation technologies in copper conductive coatings for electromagnetic interference shielding [J]. Polymer Materials Science and Engineering, 1994(6): 25-29.
  • 9URENA A, RAMS J, ESCALERA M D, SANCHEZ M. Effect of copper electroless coatings on the interaction between a molten Al-Si-Mg alloy and coated short carbon fibres [J]. Composites Part A: Applied Science and Manufacturing, 2007, 38(8): 1947-1956.
  • 10SARKAR D K, ZHOU X J, TANNOUS A. Growth of self-assembled copper nanostructure on conducting polymer by electrodeposition [J]. Solid State Communications, 2003, 125(7/8): 365-368.

引证文献3

二级引证文献16

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部