摘要
阐述了LED封装材料对大功率LED散热和出光的影响及大功率LED的发展趋势。指出目前大功率LED研究的瓶颈是如何提高散热和出光以及封装互连材料在提高大功率LED散热和出光方面所具有的重要影响。讨论了芯片粘结材料、荧光粉、灌封胶、散热基板等。分析了导热胶、银浆和合金钎料、陶瓷基板、金属基板、复合基板,讨论了对出光影响比较大的灌封胶和荧光粉的选用,指出了未来的研究重点。
An overall review of effects of packaging materials on the LED heat dissipation and light extraction was described and the development of new packaging and interconnection materials was reviewed. It is pointed out that the heat dissipation and light extraction are the bottlenecks to the development of the high brightness LED, the packaging and interconnection materials have great influences on the heat dissipation and light extraction efficiency. Die attach materials, phosphor, pouring sealant, heat dissipation substrate etc are discussed, and the thermal conductive adhesives, silver paste, solder, the metal substrate, ceramic substrate, and composite substrate are analyzed. The choice for pouring sealant and phosphors are discussed, which have big influence on the light extraction of LED. The further development focus is mentioned.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第4期281-285,共5页
Semiconductor Technology
基金
国家自然科学基金资助项目(50675130)
教育部新世纪优秀人才计划、上海市科技攻关项目(06DZ11403)
上海市重点学科资助项目(Y0102)
关键词
大功率LED
芯片粘结
灌封胶
荧光粉
基板
high efficiency LED
die attaching
pouring sealant
phosphors
substrate
