摘要
综述了国内外太阳能光伏产业及半导体等高精端电子产业中硬脆性材料线切削液的发展、分类和应用。归纳总结了国内外近年来切削液的使用量,对2008年的市场需求进行了预测,重点分析综述了国内外水性切削液产品组成、配方的研究进程及切削液产品对线切割工艺过程、晶片质量的影响,并对国内线切削液今后的发展提出了建议。
The development, sort and application of wire cutting fluids are summarized, which are used for cutting hard and brittle materials in the worldwide solar photovohaic and semiconductor industries. The recent consume amounts of cutting fluids and the market requirement for 2008 is also forecasted. The composition and formulation of cutting fluids and the effects on wafer quality during manufacturing processing are analyzed. Some suggestions are proposed on the development of wire cutting fluids.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第4期292-295,共4页
Semiconductor Technology
基金
国家发改委基金资助项目([2007]1786)
关键词
切削液
线切割
硬脆性材料
cutting fluid
wire cutting
hard and brittle material
