半导体芯片切割加工品质的评价方法

Appraising Method of Machining Quality for Semiconductor Chips

在对日本一些著名半导体生产企业实际生产中所用的质量控制方法和企业生产规范进行认真分析的基础上,提出了一组具有代表性的主要检测项目和相应的检测方法。设计了一组芯片切割实验方案并进行了切割实验,对所提出的检测项目及要求逐项进行了检测。明确了在正常切割条件下各项指标出现不合格品可能性的大小,证明了所提出的检测项目和检测方法对于控制芯片切割品质的有效性。研究成果对于芯片切割加工品质评价方法的规范化和标准化,对于高速切割机的设计和切割工艺的制定等均具有重要的参考价值。

Analysis on the quality control method or the enterprise production standard was carried out based on actual production of some famous international semiconductor enterprises, some representative examination projects and examination methods were proposed. A group of experimental plans were designed for cutting chips, and the cutting experiments were done, examined item by item, the incompetent possibility of each target under the normal cutting condition was pointed out. The validity of the p project and examination method on controlling the quality of cutting chip was proved. The research results have some important reference on the standardization of chip cutting quality appraisal method, and the design of high speed cutter and the cutting technics.