多层AHB系统中基于时分复用的高速从设备互连电路(英文)

TDMA Based High-Speed Slave Interconnect for Multi-Layer AHB

片上系统在性能和功能上的突破性进展带来了新的挑战,包括大量IP模块之间的有效互连。虽然前人已经研究并实现了多种基于共享总线的多通道平行访问方案,但是当同一个IP块被多个通道同时访问时仍然存在数据传输的瓶颈。针对经常引起资源冲突的IP块,提出了一个基于时分复用的互连电路。该电路在同一个IP块被同时访问时重新安排传输信息,以时分复用的方式分配有限的资源。它将实现多个传输通道并行访问同一个IP核时不引入额外的延时,且对IP核是透明的。最后,在双层AHB总线系统的基础上实现了该电路。

The performance and functionality breakthroughs of SoC bring new challenges, such as efficiently interconnecting a large number of IP blocks, Bottleneck still exists when the same intellectual property block is accessed simultaneously, whereas there have been considerable attempts to implement multi-channel fabrics basing on shared bus for maximum reusability. A time-division-based interconnect is proposed for the intellectual property blocks causing resource contentions frequently, which rearranges the accessing information and allocates the resources in a time-division manner. It is showed to introduce no latency to parallel transmitting accesses, and is completely transparent to the IPs. Finally, it is implemented on the basis of dual-layer AHB.