摘要
研究在柠檬酸钾和草酸铵镀液体系中镀钯工艺。结果表明，采用本实验室研制的添加剂XP－4和XP－7以及PPS和FF，则可在电流密度0.5～3.5A／dm2、温度40～60℃的宽范围内获得全光亮的钯电沉积层。钯沉积的电流效率和沉积速度在镀液中钯含量为10g／L、1．0A／dm2的条件下分别可达到92.0％和0.25μm／min，并随电流密度和镀液中钯含量的变化而改变。XP－4和XP－7均阻化钯的电沉积，提高钯电沉积的过电位。它们共存时可使把电沉积的电位负移达240mV。
Process of Pd plating from system of potassium citrate and ammonium oxalate is investigated. Results show, with additives of XP-4, XP-7, PPS and FF prepared in our laboratory, full bright Pd electrodeposit can be obtained in wide range of 0.5-3.5 A/dm2 and 4a-60℃ and at 1.0 A/dm2 and Pd 10 g/L contg in bath, current efficiency and deposition rate are 92.0% and 0.25μm/min respectively,which will be changed with change of c.d. and Pd content in bath. Both XP-4 and XP-7 inhibit Pd electrodeposition and cause increase of deposition overpotential. Their co existence can make Pd electrodeposition potential shift to negative value, up to 240mV.
出处
《电镀与环保》
CAS
CSCD
北大核心
1997年第2期3-5,共3页
Electroplating & Pollution Control
