切割太阳能硅片用金刚石内圆锯片生产工艺探讨

Processing technology of cutting solar cell silicon plate with diamond inner round saw

文章介绍的新生产工艺使产品具有极高的结合强度。生产的锯片刃口锋利、切割平稳、精度高、寿命长。对刀片的基体材质、金刚石粒度、金刚石分布、镀前处理工艺、电镀配方及电镀规范进行独特的选择和改进;通过控制阴极电流密度和上砂时间来实现金刚石在刃口上的合理分布;通过新的"除油、活化、冲击镀"前处理规范,使镀层与基体牢固结合;合理的镀液配方及电镀规范使镀层不仅具有足够高的强度、硬度和耐磨性,还具有足够高的韧性和抗冲击能力,使金刚石发挥出最佳的磨削效果。

A new manufacturing technology which would enable the product possess extremely high bonding strength was introduced in the paper. The edge of the produced saw is sharp with stable cutting performance, high precision and long life. Base material of the saw blade, diamond granularity, diamond distribution, pre-plating treatment, plate composition and plating criterion were uniquely chosen and improved. The plating layer is tightly bonded with the base through the controlling of cathode current density and diamond adding time to realize the reasonable distribution of diamond and the adopting of new pre-plating treatment criterion including oil removing, activation and concussion plating. The reasonable plating liquid composition and plating criterion made the plating layer not only attained enough strength, hardness and abrasion resistance, but also enough toughness and concussion resistance therefore have the diamond exerted best cutting effect.