摘要
磁控溅射技术在薄膜制备领域广泛应用,电源是磁控溅射镀膜的关键设备之一。本文介绍了全桥逆变直流磁控溅射电源主电路和控制电路的设计,该电源输出功率2 kW,采用PI恒流控制,具有过流保护。通过阻性负载测试表明电源具有很好恒流特性,在输出功率超过400 W时电源效率比较高。利用氮气/氩气不锈钢靶直流磁控溅射实际的等离子体负载测试表明:在保证真空室内压力不变的前提下,随着氮气比例的增加,电压下降,但电源恒流效果好,工作稳定。
Magnetron sputtering （MS） is currently being widely used in preparation of various thin films, where the power supply for MS is one of the crucial systems. The design of both the main circuit and control circuit of full-bridge inverter for dc MS power supply is presented. The ceiling power output of the system we developed is 2kW, of which the control is based on PI approach for constant current mode. The power supply is equipped with favorable over-current protection circuit. Experimental results showed that the power supply is featured by excellent constant current behavior and high efficiency with power output higher than 400W. The operation voltage of the system decreases with increasing nitrogen partial pressure during dc spttering from stainless steel target with argon-nitrogen mixture. In contrast, the operation current maintains constant in spite of the variation of operation voltage. The system runs very well under practical plasma load.
出处
《真空》
CAS
北大核心
2008年第2期70-73,共4页
Vacuum
关键词
磁控溅射
电源
全桥变换
恒流
magnetron sputtering
power supply
full-bridge inverter
constant current
