期刊文献+

钢铁基体无氰碱性镀铜的研究进展 被引量:12

Review of Cyanide-free Alkaline Copper Plating on Steel Matrix
下载PDF
导出
摘要 简要回顾了无氰碱性镀铜的发展历史。按照沉积过程中铜的价态的不同对在钢铁基体上无氰碱性镀铜的研究进展进行了说明。详细介绍了近几年来出现的无氰碱性镀铜工艺及国内外该技术的实用化情况。最后,对碱性镀铜的发展前景进行了展望。 The development history of cyanide-free copper electroplating is briefly reviewed. The progress in the study of cyanide-free copper electroplating on steel matrix is introduced according to different valences of copper in the deposition process. The different cyanide-free copper plating baths and the applications in recent years are presented in special detail. Finally, the developing trend of alkaline copper electroplating is forecasted.
出处 《电镀与环保》 CAS CSCD 2008年第2期9-13,共5页 Electroplating & Pollution Control
关键词 钢铁基体 镀铜 碱性 无氰 steel matrix coooer olating alkaline cyanide-free
  • 相关文献

参考文献37

  • 1何建平.无氰电镀工艺的研究现状及解决问题的途径[J].电镀与涂饰,2005,24(7):42-45. 被引量:29
  • 2布拉斯奇WR.一价铜无氰电镀液:中国,1256722[P].2000-06-14.
  • 3Brasch. Cyanide-free monovalent copper electroplating solutions: US, 5 750 018[P]. 1998-05-12.
  • 4Thomas M, John S Zevely. The determination of ammonia in copper pyrophosphate plating solution I-J]. Journal of the Electrochemical Society, 1984, 131(1) :109-111.
  • 5任山雄.防渗碳碱性无氰镀铜新工艺[J].电镀与涂饰,2006,25(12):49-51. 被引量:6
  • 6陈高,杨志强,刘烈炜,彭庆军.新型柠檬酸盐镀铜工艺[J].材料保护,2005,38(6):24-26. 被引量:10
  • 7雅各布斯L.无氰镀铜液及无氰镀铜方法:中国,1078505[P].1993-11-17.
  • 8Magdy A M Ibrahim. Copper electrodeposition from nonpolluting aqueous ammonia baths[J]. Plating and Surface Finishing, 2000, 87(7): 67-72.
  • 9Burstein G T, Newman R C. Reactions of scratched copper electrodeposition in aqueous solutions [J]. Journal of the Electrochemical Society, 1981,128(11) :2 270-2 276.
  • 10Jayakrishnan Sobha, Vinothini A, Kala C, et al. Electroplating oil.copper from an amine based noncyanide bath [J]. Transactions of the Institution of Metal Finishing, 2001,79(5): 171-174.

二级参考文献55

共引文献94

同被引文献150

引证文献12

二级引证文献35

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部