基于软光刻的多层光互连垂直耦合结构

A Soft-Lithography-Based Vertically Coupling Structure for Multilayered Optical Interconnection

设计并试制了一种新型垂直耦合光互连线路结构，可用于高速计算机内部等垂直堆叠的多层连通光互连的芯片问光信息通讯。其结构简单，且具有较小的连接损耗（可低至0．05dB）。对四种不同的典型波导截面（分别为30μm×30μm，50μm×50μm，100μm×100μm，200μm×200μm），利用蒙特卡罗多光线追迹分析法对跨越l～6层的垂直耦合结构进行了性能分析，发现当该结构的跨越高度与横向跨越距离的比值约为0．128时，可实现较理想的低损耗（低于1dB）光传输。采用软光刻的方法制备了实验多层光互连线路，其性能测试与理论结果基本相符。

A novel vertical coupling structure is designed for multilayered optical interconnection, regarding as one of most promising approaches for high-speed communications in next-generation computer. The layer-to-layer coupling features a simple S-shaped structure with an insertion loss as low as 0.05 dB. For four cross sections of 30μm×30μm, 50μm×50μm,100μm×100μm, and 200μm×200μm calculations for cross-over of up to 6 layers were performed using Monte Carlo ray be achieved as the fabricated by using ratio of cross-over soft-lithography and tracing simulation, it was found that a low-loss coupling （less than 1 dB） can height to traveling distance is about 0. 128. Experimental prototypes were measurement agrees with the calculated result in general.