摘要
介绍了BGA封装的概念及其分类;以实际工程实例为背景,对整个应急修复过程做了全面、细致的阐述,并由此总结出了BGA焊盘脱落的修复工艺流程;从而证明了该修复方法的通用性与实用性,为印制电路板BGA焊盘脱落修复提供了一种有效的应急解决途径。
Introduce the concept and types of BGA.Describe repaire technics in detail according to actual project example.Summarize a repaire flow of PCB that the BGA pad is off.The repaire method proved to be effective and practial,is an emergent method to solving BGA pad off and similar problems.
出处
《电子工艺技术》
2008年第2期87-88,104,共3页
Electronics Process Technology
