电子元器件电镀专用处理剂的研制

Development on Special Electroplating Treating Agent of Electronic Components

电子元器件电镀专用处理剂应用于电子元器件电镀自动生产线,其组成为前、后处理剂两部分,同时使用于生产线的不同工序。电子元器件生产的自动化要求高水平专用处理剂为其配套。通过研制专用处理剂满足电子元器件电镀自动生产线要求,并达到国内先进水平,同时进行专用处理剂的腐蚀性实验,列出了酸浓度与腐蚀度关系和酸浓度与溶锡量的关系。

The special electroplating treating agent of electronic components is applied in the automatic production line of electroplating of electronic components. The agent is divided into pre- treating agent and post - treating agent which are applied in different process of the line. The automation of the production of electronic components requires special treating agent with high level. The development of special treating agent meets the needs of automatic production line of electroplating of electronic components and reaches advanced domestic standards, The development also does the corrosion experiment of the agent and presents the relationship between the consistency of acid and degree of corrosion and that between the consistency of acid and tin amount.