含环氧基聚二甲基硅氧烷及其硫化过程的分子运动

Molecular Motion of Epoxy-Containing Polydimethylsiloxanes and Their Crosslinking Process

采用扭辫分析法详细研究了含环氧基聚二甲基硅氧烷在１１０～２３０Ｋ范围内的分子运动情况，讨论了环氧基团对聚二甲基硅氧烷主链的玻璃化转变温度、次级转变温度、熔融温度及粘流温度等动态力学性质的影响。并探讨了含环氧基聚二甲基硅氧烷在３００～４４０Ｋ温度范围内的交联反应过程。结果表明，有机胺类化合物及胺基硅树脂在３６３～３８３Ｋ范围内与含环氧基聚硅氧烷有良好的反应活性。

The temperature spectra of the dynamic mechanical properties of epoxy-containing polydimethylsiloxanes and their crosslinking process were determined over a temperature range from 110K to 230K and 300K to 440K by using the torsional braid analysis(TBA). The influence of the epoxy groups on the T g, secondary creep temperature(T β), T m and fluid temperature(T f) is discussed. Aliphtic polyamine(PEPA) and amino-containing polydimethylsiloxane (N-SR) have good reaction activity with the epoxy-containing polydimethylsiloxanes over range temperature from 363 to 383K.