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络合剂对Co-Fe-P镀层化学沉积速率和结构的影响 被引量:1

The Influence of Complex on the Deposition Rate and Structure of Co-Fe-P Alloy Prepared by Electroless Deposition
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摘要 采用化学镀方法制备Co-Fe-P合金,分析络合剂种类和浓度对化学镀层沉积速率和镀层结构的影响.重量法和电化学法测试所得的沉积速率表现出相似的趋势,即镀层沉积速率随着镀液中柠檬酸三氨含量的增大而增大.由于析氢等副反应的发生,电化学方法计算所得的沉积速率大于重量法所得的沉积速率.镀液中络合剂的不同会影响所制备镀层的结构,X射线衍射结果表明单独使用酒石酸钾钠为络合剂所得镀层晶化程度最大,而采用柠檬酸三钠和柠檬酸三氨为络合剂时所得镀层的晶化程度下降,有向微晶和非晶结构转变的倾向. In this paper Co- Fe- P alloy was prepared by chemical plating. The effects of complex on the deposition rate and structure were analyzed. Gravimetric analysis and electrochemical results show that the deposition rate displays similar trend, i. e., the deposition rate increases with the increase of (NH4)2C6H5O7 content. The deposition rate determined by electrochemical measurement is higher than that calculated by gravimetric measurement. This can be attributed to the by reaction such as hydrogen evolution. The results of XRD shows that the alloy obtained with C4 H4O6KNa as sole complex displays crystalline structure, while those obtained with (Na)a C6H5O7 or (NH4)3 C6H5O7 as sole complex displays the tendency to crystallite and amorphous structure.
出处 《湘潭大学自然科学学报》 CAS CSCD 北大核心 2008年第1期92-94,104,共4页 Natural Science Journal of Xiangtan University
基金 湖南省科技厅资助项目(2007CK3057 2007FJ4136) 长沙环境保护职业技术学院[2007]58号课题(NYC0705) 湘财建指[2007]185号课题
关键词 化学镀 电化学方法 重量法 Co—Fe—P合金 络合剂 electroless plating electrochemical measurement gravimetric analysis Co- Fe- P alloy complex
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  • 1马杰,吴玉程,张勇,王文芳,乔祎,郑玉春,刘玉,黄新民,李广海,张立德.化学沉积Co-Fe-P纳米涂层结构与磁学性能研究[J].金属功能材料,2004,11(1):4-8. 被引量:4
  • 2PETROV N,SVERDLOV Y, SHACHAM--DIAMAND Y. Electrochemical study of the electroless deposition of Co(P) and Co (W, P)alloys[J]. Journal of the Electrochemical Society, 2002,149(4):C187-C194.
  • 3GEORGIEVA J, ARMYANOV S. Factors affecting the electroless deposition of Ni-Cu-P coatings[J]. Journal of the electrochemical society 2003,150(11) :C760-C764.
  • 4NAOYUKI Fujita, AANMI Tanaka, EIJI Makino, et al. Fabrication of amorphous iron-boron films by electroless plating.[J]. Applied Surface Science, 1997,113/114:61- 65.
  • 5HUANG Gui-fang, HUANG Weiq-ing, WANG Ling-ling, et al. Electrochemical study of electroless deposition of Fe-P alloys[J]. Electrochimica Acta, 2006,51 : 4 471- 4 476.

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