一维纳米结构的拉伸力学测试

Tensile Tests on 1D Nano-Structures

对一维纳米结构开展轴向拉伸测试时,面临着样品制备、装载、拉伸、样品的轴向应力与应变的高精度测量等难点,解决途径包括改造现代显微仪器、研制MEMS力学测试芯片及发展一维纳米样品的制备与装载技术。从实验使用的测试仪器及拉伸方式出发,将目前发表的一维纳米拉伸实验分为基于探针、MEMS和电子束辐照开展的拉伸实验,并对各种实验方法进行了比较。发现基于MEMS的拉伸实验由于其对测试仪器的改造小、花费少、且通过设计制作不同测试功能的芯片可实现多样测试,是更有发展前景的测试技术。

Performing tensile tests on 1D nano-structures faces the difficulties of sample preparing, loading, stretching and measuring, which are managed with the development of modern microscopy, microelectromechanical system （MEMS） mechanical-testing chip and the sample preparing and loading of 1D nano-structures. These so far published tests based on probes, MEMS chip and electron radiation were summarized and compared. It is found that the tensile tests by using MEMS mechanical-testing chip has a better prospect for less modification on testing sets, less cost and easier realization to different tests by designing different functioned MEMS chips.