摘要
研究了Sn-0.7Cu,Sn-Ag-Cu,Sn-3.5Ag等软钎料合金对1060Al的润湿性,结果表明钎料中Ag含量在1.5%-2.5%（质量分数）之间润湿性最好。SEM观察发现,钎料合金/Al界面处Ag2Al金属间化合物并不是从基体Al向外生长,而是与Al之间隔了一层富Sn相。最后结合Ag-Al扩散模型与键参数函数理论对Ag-Al化合物相的生长过程及润湿性的影响作出了解释。
The wettiability of several lead-free solders,e.g.Sn-0.7Cu,Sn-Ag-Cu and Sn-3.5Ag,on 1061Al alloy had been studied.The experimental results indicate that the solder with Ag content between 1.5wt%-2.5wt% has the best wettability.SEM analysis showed that the Ag2Al intermetallic compound at the solder alloy/Al interface did not grow from the Al base,but was separated from the Al base by a Sn-rich phase.Ag-Al diffusion model and bond parameters function theory has been used to explain the growth of Ag-Al IMC and its effect on the wettiability.
出处
《焊接》
北大核心
2008年第3期47-54,共8页
Welding & Joining
关键词
铝
无铅软钎焊
润湿性
Ag-Al扩散模型
aluminum, lead-free soldering, wettiability, Ag-Al diffusion model
