亚单层铜薄膜生长的动力学蒙特卡罗模拟

Kinetic Monte Carlo Simulation of Submonolayer Copper Film Growth

建立了亚单层铜薄膜生长的三维模型,用动力学蒙特卡罗方法对亚单层铜薄膜的生长过程进行了模拟,研究了衬底温度和沉积速率对亚单层铜薄膜生长的影响,结果表明,随衬底温度升高和沉积速率降低,岛形状由离散型逐渐转变为紧致型,形成近四方形的岛,岛的平均尺寸急剧增大,岛的数目迅速减少,衬底温度达到一定值之后,岛的数目基本不变.

Modeling and simulation of submonolayer growth of copper film were carried out using the kinetic Monte Carlo method. The influence of substrate temperatures and deposition rates on the morphology of copper film was studied. The results show that the morphology of submonolayer copper films changes from dispersod islands to nearsquare compact islands with increasing substrate temperatures and decreasing deposition rates. The average sizes of the islands rise sharply with increasing substrate temperatures and decreasing deposition rates. The number of the islands decreases rapidly with increasing the substrate temperature and decreasing deposition rate. The number of islands doesn＇ t change when the substrate temperature is more than a certain value.