焊膏印刷领域中的热门先进技术

Popular Advanced Technique in the Field of Solder-paste Printing

焊膏印刷是SMT生产中关键工序之一,其控制直接影响着组装板的质量。文章简要介绍了当前焊膏印刷领域中的一些热门先进技术,例如焊膏喷印和3DAOI等。焊膏喷印是现代组装技术的新概念,它的出现促进了SMT的发展。可以确信焊膏喷印将会被更多地应用于电子组装上,成为一种具有竞争力的焊膏印刷技术。

Solder-paste printing plays an important part in SMT production, and affects the quality of assembliesf-the article simply introduces popular and advanced technique in the field of solder paste printing, for example, JetPrinting and 3D AOI, etc. JetPrinting is a new concept of the contemporary assembly technology. It is said that JetPrinting technology has developed and innovated SMT since it was appeared. It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.