多胶粉云母带胶粘剂的结构与性能分析

The Analysis of the Structure and Properties of the Micabond Used in the Rich Resin Micapaper Tapes

本文对大型高压发电机主绝缘用F级粉云母带的粘合剂进行了研究,对其中几种典型的固化体系,如环氧树脂-桐油酸酐-双马来酰亚胺体系、环氧树脂-羧酸盐(苯甲酸铅)体系以及此二者的混合体系的介电性能、力学性能和耐热性能进行了分析,并对有关体系的固化反应作了探讨.研究结果认为体系中引入双马来酰亚胺可提高热变形温度、热态强度和介电性能,双马来酰亚胺在固化中主要是自聚而不是和环氧基共聚.环氧-羧酸盐体系虽然热变形温度和热态强度较高,但高温下介电性能差,耐热老化性能也不好.但如严格控制铅盐的用量,把上述两种体系结合起来还是值得重视的.

This paper deals with the micabond used in rich resin micapaper tapes of class F for main insulation in large generator of high voltage.The dielectric and machanical properties and thermal endurance of some typical systems, such as epoxy resin-tung oil anhydride-bismaleimide system, epoxy resin-metal carboxylate (lead benzoylate) system and the combination of the above two systems, were studied, and the curing reaction of these systems were also investigated.The results reveal that introducing bismaleimide into the cured system can improve the heat distortion temperature, flexural strength at high temperature and dielectric properties. In addition the reaction scheme of bismaleimide is mainly the self-polymerization but not copolymerization with epoxy group. The cured system of epoxy resinlead benzoylate has high heat distortion temperature, but its dielectric properties at high temperature and heat ageing life deteriorate. The combination of the above two systems is well worth notice, if the amount of added lead salt is severoly controlled.