摘要
以ＣＩＣ多层印制板为主线研究印制板的热设计、热匹配的途径，以满足印制板上功率元器件的散热、热匹配及电磁屏蔽等要求。
Discuss and expound the way of heat design and heat matching of printed circuit board based on CIC multiplaten printed circuit board.The way can meet the requirements of heat sinking,heat matching and electromagnetic shield etc.of power components on printed circuit board.
出处
《电子工艺技术》
1997年第6期213-217,共5页
Electronics Process Technology
关键词
多层印制板
散热
热匹配
CIS
Invar Multiplaten printed circuit board Heat-sinking Heat matching
