摘要
全面介绍了Ｐ１８—Ｔ２００型台式再流焊机的结构特征、工作原理及其相关技术指标，并结合再流焊机设计中的关键技术问题，提出了自己的解决方案。
This article thoroughly introduces structure characteristic working principle and related technical index of Model P18-T200 Platform Reflow Soldering System.In connection with critical technology of reflow solding design,put forward the wtiters' solving method.
出处
《电子工艺技术》
1997年第6期218-220,共3页
Electronics Process Technology
关键词
再流焊机
组装技术
SMT
Reflow soldering IR radiation Convective heat transfer Temperature uniformity Surface Mount Technology
