摘要
Ｃｕ－Ｎｉ－Ｓｎ合金是调幅分解强化型合金。与铍青铜相比，该合金性能优良、价格便宜，因此是一种很有发展前途的铜基弹性材料。本文综述了Ｃｕ－Ｎｉ－Ｓｎ合金的研究现状，对材料的制备、热处理工艺、合金的强化机理、微观结构、性能、及它们在电子工业中的应用作了介绍。
The Cu Ni Sn alloy is an attractive copper based elastic material strengthened by spinodal decomposition.This alloy is cheaper and superior in the properties to beryllium bronze.In this paper,preparation,heat treatment,strengthening mechanism,microstructure,properties of the alloy as well as its application to electronics industry are overviewed.
出处
《材料科学与工程》
CSCD
1997年第3期61-65,共5页
Materials Science and Engineering
关键词
弹性合金
调幅分解
高弹性导电合金
Cu Ni Sn alloy\ elastic alloy\ spinodal decomposition
