摘要
本文研究了不同Sn添加量对无取向硅钢薄带磁性能的影响,通过扫描俄歇微探针(SAM)观察到了Sn在常化板中的晶界偏聚行为,对比了Sn添加对成品织构的影响。结果表明,添加Sn能够明显降低无取向硅钢的铁损值,当Sn含量为0.1%时铁损值最低,Sn的晶界偏聚降低了晶界能从而抑制了{111}组分在晶界处的形核和长大,降低了成品钢带中{111}组分的强度。
The effect of Sn contents on core loss in non-oriented electrical steel were investigated, the grain boundary segregation of Sn in normalized bands was detected by scanning auger microprobe （SAM） and the texture of final annealing specimens were analyzed. The addition of Sn can reduce core loss obviously and the content of 0. 1 %Sn do the best effect. The grain boundary segregation of Sn reduce the grain boundary energy and retrain the nucleation and grain growth of { 111 } texture so the intensity of { 111 } texture is decreased.
出处
《金属功能材料》
CAS
2008年第2期5-8,共4页
Metallic Functional Materials
关键词
Sn含量
晶界偏聚
铁损
织构
无取向
Sn content
grain boundary segregation
core loss
texture
non-oriented
