摘要
采用化学沉积的方法,在低碳钢表面上制备Ni-Cu-P三元合金镀层,研究了镀液组成和操作条件对镀层沉积速率和显微硬度的影响,确定了最佳工艺条件为:硫酸镍30g/L,次亚磷酸钠15g/L,硫酸铜3.5g/L,pH=9,95℃,负载因子0.48dm2/L,醋酸钠20g/L,柠檬酸三钠60g/L,沉积时间2h,采用X射线衍射仪(XRD)和扫描电子显微镜(SEM)对镀层进行表征。结果表明:所得的化学镀层为非晶态,经过400℃热处理后镀层晶化。镀层的沉积速率和显微硬度随硫酸铜浓度、次亚磷酸钠浓度及pH值的增加先增后减,随温度的升高而增加。
Electroless deposition of Ni-Cu-P alloy on mild steel specimens was carried out. The effects of composition of bath and operating condition on the deposition rate and microhardness of Ni-Cu-P deposits were studied. The optimal process conditions were identified as follows: 30g/L NiSO4 · 6H2O, 15g/L Nail2 PO4 · H2O, 3.5g/L CuSO4 · 5H2O, pH=9, 95℃, loadfactor of 0.48dm^2/L, 20g/L CH3COONa, 60g/L C6HsOTNa3 · H2O,plating time 2h. The electroless Ni-Cu-P deposits were characterized by XRD and SEM. The results show that the electroless Ni-Cu-P deposits have amorphous structure. After heat treatment at 400℃, the electroless Ni-Cu-P deposits were crystallized. The deposition rate and microhardness first increased and then decreased with increasing the concentration of CuSO4 and NaH2PO4 and pH of bath, while increased with increasing temperature.
出处
《金属功能材料》
CAS
2008年第2期24-28,共5页
Metallic Functional Materials
基金
国家自然科学基金(批准号:20571022)
教育部博士点基金(批准号:20060359011)
安徽省教育厅重点科研项目(2006KJ044A)