摘要
使用Ansys有限元软件建立三维BGA封装模型,考虑在不同的保温时间和升降温时间情况下焊点的力学行为,并通过Darveaux的失效模型来计算并比较封装体的疲劳寿命。结果表明:对于焊点在温度循环过程中的疲劳寿命来说,保温时间的影响比升降温时间的影响大,保温时间超过20min之后对寿命的影响就很小了,说明温度循环测试的关键不应该在升降温时间而应该在保温时间上。
A 3-D modle of BGA package is established based on Ansys to investigate the mechanical behavior of solder by different dwell time and ramp time. The thermal cycle lives are calculated and compared according to Darveaux equations. Results demonstrate that solder joint fatigue life is more sensitive to dwell time than ramp time during thermal cycling. Increasing dwell time past 20min has a minimal effect on the lifetime. The focus of temperature cycling tests should not be upon ramp time ,but upon dwell time.
出处
《传感器与微系统》
CSCD
北大核心
2008年第4期68-70,73,共4页
Transducer and Microsystem Technologies
基金
广西自然科学基金资助项目(0339037)
