摘要
考察了镧-镱改性化学镀钯各主要工艺参数氯化钯、水合肼、乙二胺四乙酸二钠盐、镱-镧混合浓度和镀覆温度对钯沉积速度的影响。在此基础上,建立了钯沉积速度的动力学方程。经实验验证,该数学模型与实验结果吻合度较好,对镧-镱改性化学镀钯沉积过程的调节和产物的控制具有一定的参考价值。
Single factor method was used to investigate the effects of the main technical parameters in electroless Pd plating process, such as the concentations of palladium chloride, hydrazine hydrate, complexon(e) Ⅱ , ytterbium - lanthanum and plating temperatureon,on the Pd deposition rate,based on which, the kinetic equation of palladium deposition was established. The experiment proved that the mathematical model was in a good accordance with the practical results, which has certain reference value for the process adjusting and product controling of the palladium deposition.
出处
《南昌大学学报(工科版)》
CAS
2008年第1期12-15,共4页
Journal of Nanchang University(Engineering & Technology)
关键词
钯
化学镀
动力学
镀速
palladium
electroless plating
kinetics
deposition rate