摘要
综述了微晶玻璃的各项优异性能,微晶玻璃与金属封接的基本理论要求。介绍了微晶玻璃与可伐合金(Kovar)封接的国内外研究现状,同时介绍了微晶玻璃在计算机芯片和固体氧化物燃料电池(SOFC)封接包装领域中的应用。
Excellent performances of glass-ceramic is summarized and the essential requirement of sealing for both glass-ceramic and metal is discribed. The research foreground on the sealing of glass-ceramic with kovar alloy is introduced and the application in the field of sealing and packaging of silicon chip and solid oxide fuel cell（SOFC） is covered.
出处
《材料开发与应用》
CAS
2008年第2期72-76,共5页
Development and Application of Materials
