电子器件分析用新型显微红外热像仪

The New Thermal Microscope Imaging System for Electronic Device Analysis

为了给半导体器件、印刷电路板和功率器件等电子器件提供细微热分析的手段,完成电子电路的故障检测、失效分析和可靠性检测等,基于非制冷焦平面探测器设计了一种新型的显微红外热像仪。介绍了系统的工作原理、系统构成、工作过程。研究了显微红外热像仪噪声等效温差(NETD)和噪声等效辐射率差(NEED)模型,为系统的设计提供了理论指导。提出了一种自适应的非均匀校正算法,并基于VisualC++完成了整个系统的软件设计。实际图像采集和处理结果表明了本系统设计的合理性,该系统将加速我国在电子制造和应用领域的发展。随着产品化,本系统将会用到其他需要显微热分析的场合,具有广泛的应用前景。

In order to supply the minute thermal analysis for semiconductor, PCB and power device and to complete the failure testing, invalidation analysis, reliability detection, we proposed a novel digital thermal microscope based on the uncooled focal plane detector. We give the operating principle, system construction and the mathematical mode of noise equivalent temperature difference （ NETD ）. Furthermore we proposed an adaptive nonuniformity correction algorithm and the software based on Visual C＋＋ for the UFPA. Results of real thermal image experiments have shown that the digital thermal microscope is designed successfully. Thus it will improve the development of the electronic manufacturing and application. With the development of the system, the digital thermal microscope can be used in other fields and has a bright prospect.