摘要
研制了一种新的用于电子封装的无卤素助焊剂,并参考日本工业标准和相关国家标准对其进行了全面的性能测试。结果表明,该助焊剂在可焊性、绝缘性、腐蚀性等方面均符合标准,且具有焊接效果良好、无卤素、无毒、环保,焊后免清洗等优点。
A new type of halogen - free no - clean flux was developed for the lead - free solder wire. Some experimental tests were done according to JIS and relative GB, and results show that this flux has fulfilled requirements of the standard in insulatibity, causticity and solderability. In addition, this flux has many good performances, such as excellent soldering performance, halogen - free, innoxiously, environmentaUy friendly and no - dean after soldering.
出处
《山东化工》
CAS
2008年第3期17-20,共4页
Shandong Chemical Industry
基金
湖南省科技计划资助项目(2007GK3057)
关键词
焊锡线
无卤索
助焊剂
环保
solder wire
halogen - free
flux
environmentally friendly
