Ar等离子体清洗Cu箔靶的实验研究

The study of cu foil target cleaning by Ar plasma

极薄的铜箔是惯性约束聚变中常用的靶材之一，要求密度达到晶体理论密度、表面洁净、粗糙度低、润湿性好，用常规方法清洗厚度在2μm及以下的铜箔，难以达到要求、本实验采用Ar等离子体清洗2μm厚的铜箔，比较研究了Ar等离子清洗和常规清洗的不同，且对不同条件下清洗铜箔的表面性质进行研究．实验结果表明，常规有机溶剂清洗的铜箔，表面有微量的油污残留，暴露在空气中易氧化，经Ar等离子体清洗的铜箔，表面洁净、暴露在空气中不易氧化，Ar等离子体清洗10～20min，表面性质最佳，清洗彻底，润湿角明显减小（减小近20°），表面自由能增大（增大18.5％）、表面光洁度满足制靶要求.

In the inertial confinement fusion target preparation, we need the cuprum foil which has dear surface, well roughness and contact angles. But the conventional cleaning method can＇t achieve our need when cleaning 2 μm thickness cuprum foil. The 2 μm thickness cuprum foil were cleaned by argon plasma, comparing with the conventional method, and studying the surface properties of cuprum foil using different plasma cleaning conditions. The results indicate that the surface of cuprum foil cleaned by conventional method has a little oil and is easy to be oxidized in the atmosphere. But the surface of cuprum foil cleaned by argon plasma has a very clean surface and isn＇t easy to be oxidized in the atmosphere. Meanwhile cleaning time of 10-20 minutes is very well for argon plasma. During the time, contact angles reduce markedly （reduce nearly 20°）, surface＇ flee energy increase （increase 18.5% ）, surface roughness descends in a small rank, and comparing conventional method we obtain many good properties by argon plasma cleaning.