环形SrTiO_3双功能元件的焊锡和通流能力研究

Study on soldering tin and through current capability of ring SrTiO_3 double function component

采用固相合成法,研究了SiO2含量和收缩温度对环形SrTiO3压敏元件微观组织、气孔率的影响。结果表明:元件在1050℃时开始收缩;通过SEM分析,发现随着SiO2含量的增加,元件的气孔率有减少趋势;当x(SiO2)为0.05%～0.10%时,可以获得良好的微观组织。通过改进工艺参数制备压敏元件。焊锡并通100mA电流后,压敏电压的变化率ΔV·V–110mA为0.95%～3.60%,电容变化率ΔC·C–1为9.6%～16.4%。

The effects of various amounts of SiO2 additive and contracting temperature on microstructures and air hole quotiety of ring SrTiO3 varistor component were studied by solid phase synthesized method. The results show that the component begins contract at 1 050 ℃; by SEM analysis, with the increase of added amount of SiO2, air hole quotiety of component decreases; good microstructures are obtained when x（SiO2） is 0.05%-0.10%. The varistor component was made by -1 improved technical parameter. After soldering tin and 100 mA of surge current, the ΔV·V10mA ^-1 andΔC·C^-1 are 0.95%-3.60% and 9.6%- 16.4%, respectively.