摘要
鉴于电路板生产过程中环保和成本的要求,采用唑类缓蚀剂取代传统的锡铅合金镀层以保证可焊性。探讨了唑类缓蚀剂的保护机理、应用情况及发展前景。
In view of the improvement on environmental protection and the reduction of costs for PCBfabrication, emphasis has been placed on the use of corrosion inhibitors as replacements for conventional tin -lead electrodeposits for the preservation of solderability. The protection mechanism of azolesas well its their application rsults and challenge in future was investigated.
出处
《电镀与涂饰》
CAS
CSCD
1997年第4期11-14,共4页
Electroplating & Finishing
关键词
电路板
缓蚀剂
唑类
缓蚀剂
PCB,corrosion inhibitor, azole series