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基于LTCC技术的SIP研究 被引量：3

Study on SIP Based on LTCC Technology
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摘要 SIP是继SOC后快速发展起来的,采用微组装和互连技术可以在单封装内实现子系统或系统功能。低温共烧陶瓷(LTCC)技术是实现SIP的重要途径。采用LTCC技术的SIP具备高集成度,方便集成无源元件无源功能器件,通过调整配料和多种不同介电常数基板混合共烧的方式提高电路设计灵活性等。对基于LTCC技术的SIP特点和优势进行了讨论,并根据需要结合实际工作给出了一个采用LTCC的X波段射频接收前端SIP的实例。 System in a package （SIP） is a rapid development technology after SOC. An SIP, utilising multi-chip assembly and high density interconnection techniques, usually has entire electronic system functions in a package. Low temperature co-fire ceramic （LTCC） technique is a good choice for SIP due to its special characteristics, especially in high speed and microwave usages. The benefits and advantages of LTCC were elaborated, and X band SIP receiver in LTCC technology was presented.
作者 洪求龙 吴洪江 王绍东
机构地区 中国电子科技集团公司第十三研究所
出处 《半导体技术》 CAS CSCD 北大核心 2008年第5期414-416,共3页 Semiconductor Technology
关键词 低温共烧陶瓷 系统级封装 频接 LTCC SIP RF
分类号 TN305.94 [电子电信—物理电子学]
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参考文献6

  • 1HEO K, LIM J H, MUN J, et al. Characterization and wideband modeling of miniaturized LTCC helical induetors [ J ]. IEEE Microwave And Wireless Components Letters, 2007, 17 ( 3 ) : 160-162.
  • 2LOSKOT E, KONDRATIEV V, VENDIKL I, et al. Design of resonators and filters based on LTCC lumped components[ C] .30^th European Microwave Conference. Paris, France,2000:1-4.
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  • 5吴德馨.集成电路系统级封装(SIP)技术和应用[R].集成电路粤港台论坛演讲稿.广州,2005.
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共引文献1

同被引文献25

  • 1SIMON W,KULKE R,WIEN A, et al. Interconnects and transitions in multilayer LTCC multichip modules for 24GHz ISM Band Applications [C]//IEEE MTT-S INT Microwave Symp DigestBoston, MA, USA, 2000:1047-1050.
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  • 3HEYEN J,KERSSENBROCH T V,CHERNYAKOV A, et al. Novel LTCC-/BGA-modules for highly integrated millimeterwave transceivers [C]//IEEE MUT-S Int Microwave Syrup Digest Philadelphia, USA, 2003:1041- 1044.
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  • 5吴德馨.集成电路系统级封装(SIP)技术和应用[R].集成电路粤港台论坛演讲稿,广州,2005.
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引证文献3

二级引证文献11

半导体技术
2008年 第5期

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