二层法挠性覆铜板用新型热塑性聚酰亚胺树脂的合成及应用研究

Synthesis and Application of the thermoplastic polyimide resin used in FCCL

本文采用新型柔性二胺单体3,4’-二胺基二苯基醚(3,4’-DAPE)配合常用二酐单体,合成了一种可用于二层法挠性覆铜板的热塑性聚酰亚胺树脂,并用红外光谱(FTIR)、动态力学分析仪(TMA)对其进行了分析。并重点探讨了其在挠性覆铜板生产中的涂布、亚胺化及层压工序存在的问题。

The thermoplastic polyimide （TPI） used in the 2-layer Flexible Clad Copper Laminate （FCCL） was synthesized with the novel monomer 3,4＇-diaminodiphenyl ether （3,4＇-DAPE） as the flexible chain and was characterized by FITR,TMA respectively. The application of TPI in FCCL producing processes, especially in the casting, imidizing and laminating process, was analyzed.