电沉积Cu/Ni多层膜硬度与调制波长关系的研究

Research on Relationship Between Hardness and Modulated Wavelength of Cu/Ni Multilayers by Electrodepositing

分别采用双槽法和单槽法制备了不同调制波长的Cu/Ni多层膜,研究了多层膜硬度与调制波长之间的关系。结果表明,当调制波长大于33nm时,硬度与调制波长的关系符合Hall-Petch关系式;小于33nm时,偏离了Hall-Petch关系式;等于21nm时,硬度出现了峰值,约为HV451.8。

In this paper different modulated wavelength of Cu/Ni multilayers was prepared by using double-bath and single-bath methods respectively.The relationship between the hardness and the modulated wavelength was studied.The results showed that when the modulated wavelength was more than 33 nm,the Hall-Petch relationship can be applied.However,with grain sizes less than 33 nm,a clear deviation from the regular Hall-Petch relationship was observed resulting in a plateau in the hardness curve at about HV451.8 for grain size of 21 nm.