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Ti对Al-Ag-Cu反应扩散连接SiCp/2618Al复合材料接头组织及力学性能的影响

Effects of Ti on the microstructure and mechanical properties of reactive diffusion bonded SiC_p/2618Al composite joints by using the Al-Ag-Cu interlayers
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摘要 采用Al、Ag、Cu等混合粉末作为中间夹层对铝基复合材料(SiCp/2618Al)进行反应扩散连接,通过在中间夹层中添加Ti,研究了Ti对接头组织结构和力学性能的影响。研究结果表明:在连接温度540℃,保温60min的情况下,Ti的加入改善了Al-Ag-Cu共晶液相对铝基复合材料表面Al2O3氧化膜和SiC颗粒的润湿性,可以获得均匀致密度高的连接接头;接头主要由Ag、Al和Al-Ag固溶体组成,在其中分布了少量的Al4Cu9、Al3Ti、Ag2Al和SiC;接头的剪切强度随Ti添加量的增加而提高,但过多的加入Ti反而降低接头的剪切强度,当Ti添加量为2·1%(质量分数)时,连接效果最好,接头剪切强度可达到101MPa。 Reactive diffusion bonding of metal matrix composites (MMC) SiCp/2618 Al was carried out by using Al, Ag and Cu mixed powder as interlayer. The influence of Ti on the microstructure and mechanical properties of the joints was studied. The results show that when a little Ti powder is added into the interlayers as a active element, the wettability of Al-Ag-Cu euteetie liquid to Al2O3 and SiC on the surface of SiCp/2618Al MMC is improved and dense metallurgical joints are acquired at 540℃ for 60min. The joints are mainly composed of Ag, Al and Al-Ag phases and small quantity of Al4Cu9, Al3Ti, Ag2Al, SiC phases distributed in Ag, Al and Al-Ag phases. The shear strength of joints is enhanced as the content of Ti increasing. But too much Ti reduces the shear strength. The highest shear strength of joints appears when the content of Ti is 2. 1wt%, which is up to 101MPa.
出处 《粉末冶金技术》 EI CSCD 北大核心 2008年第2期106-110,共5页 Powder Metallurgy Technology
关键词 反应扩散连接 中间夹层 TI 铝基复合材料 reactive diffusion bonding interlayer Ti SiCp/Al MMCs
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