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微流控芯片透光性基底SU8曝光工艺 被引量:1

SU8 lithography process in fabrication of transparent microfluidic chips
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摘要 研究了在透光性基底上直接光刻SU8光刻胶制作可实现光集成微流控芯片的工艺,讨论了基底厚度、透光性和样品承载台表面反射性等因素对透光性基底上SU8光刻图形质量的影响。研究结果表明,通过减少样品承载台表面对紫外光的反射,可有效的解决光刻胶内非定义曝光区域出现感光交联的问题。 The fabrication of micro- fluidic chips ed optical detection was studied, and the factors thickness, transparency and reflectivity of sample the exposure of SU8 by the reflective UV can be holder surface. by SU8 lithography on transparent substrate for integrataffect on the quality of lithography such as substrate's holder surface were discussed. The results indicate that avoided by reducing the reflection index of the sample holder surface.
出处 《功能材料与器件学报》 CAS CSCD 北大核心 2008年第2期426-430,共5页 Journal of Functional Materials and Devices
基金 中国科学院王宽诚博士后工作奖励基金 中国科学院创新项目基金
关键词 微流控芯片 透光性基底 SU8光刻 microfluidic chips transparent substrate SUB lithography
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参考文献14

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