摘要
本文介绍了三维立体(3D)封装的两种主要的结构形式,分析了3D封装的特点和优势,在对国内外有关3D封装研究成果总结的基础上,指出了3D封装结构与热设计所面临的挑战,提出了应对这些挑战所应研究与解决的问题,对于3D封装的结构与热设计研究具有一定的参考价值、
This paper presents the two main forms of three-dimensional Package (3D) structure. The characteristics and advantages of 3D Package are analyzed in this paper. Reviewing the research paper around the world about 3D Package, propose the challenges of 3D Package structure Design and thermal design. Study issues dealing with these challenges are pointed. This work will help the structure and thermal design study of 3D package.
出处
《深圳信息职业技术学院学报》
2007年第4期40-43,共4页
Journal of Shenzhen Institute of Information Technology
关键词
3D封装
结构设计
热设计
可靠性
3D package
structure design
thermal design
reliability