摘要
以正硅酸乙酯[Si(OC2H5)4],γ缩水甘油醚基丙基三甲基硅烷[CH2OCHCH2O(CH2)3Si(OCH3)3,简称KH560],胺基三甲基三乙氧基硅烷[NH2(CH2)3Si(OC2H5)3,简称KH550],二乙烯三胺基甲基三乙氧基硅烷[NH2CH2CH2NHCH2CH2NHCH2Si(OC2H5)3,简称ND230]为原料,用溶胶凝胶(solgel)工艺,把胺基引入材料基质中,制备了一些有机改良材料,用红外光谱、差热分析和热失重分析方法研究了材料的结构和性能。在50℃烘箱中经较长时间处理得到的块体材料能用手工抛光而不破裂,表现了较好的弹性和稳定性。经200℃热处理的复合材料,在红外光谱中明显显示存在着胺基结构。TG分析表明复合材料大约在300℃以后由于有机物的挥发和分解而大量失重。
Ormosils containing aminogroup(NH 2—) were synthesised with divinnylmelthytrie thoxysilane (ND230),3aminopropyltrietroxysilane(KH550),3glycidoxypropltrimethoxysilane(KH560),and tatraethyl silicate(TEOS).The structure and characteristics of ormosils were studied with IR,DTA and TG.The materials through heattreatment at 50℃ possess better flexibility and mechanical strength,and can be polished manually.After heattreatment at 200℃,the peak of aminogroup can be seen clearly in IR spectra.Ormosils thus obtained lose weight greatly after heattreatment above 300℃ due to volatilization and decomposition of organic part of ormosils.
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
1997年第5期554-560,共7页
Journal of The Chinese Ceramic Society